This paper addresses the design, fabrication and packaging issues of SSOP(super slim optical pickup) module using blury technology. By using blu-ray technology, which uses a 407nm LD (Laser Diode) and an objective lens having NA (Numerical Aperture) 0.85, storage devices become miniaturized but have a high capacity. The developed prototype
uses the integrated structure of a SiOB (Silicon Optical Bench) and a mirror substrate. The SiOB should be processed in order that a thin film PD(Photodiode) and interconnections, LD, Lens, QWP(Quarter Wave Plate) and HOE can be placed, and on the Silicon Substrate should Micromachined Silicon Mirror be formed. The SiOB is aligned and bonded
with the wafer on which Silicon Mirror was formed. Then, it is diced. Because it is fabricated through this order, the super slim optical pickup can be fabricated by using wafer-level process. As a final step LD on the SiOB and HOE are mounted, assembled and bonded using an active alignment. The proposed SSOP was prototyped and characterized by measuring wavefront error and detecting static focusing and tracking error signals.