Fabrication of an optical-electrical printed circuit board (OE-PCB) by double-side lamination of an embedded polymer waveguide board between two electrical printed circuit boards

Hyun-Shik Lee; Shinmo An; Beom Hoan O; Seung-Gol Lee; El-Hang Lee

doi:10.1117/12.650100

3 March 2006 Fabrication of an optical-electrical printed circuit board (OE-PCB) by double-side lamination of an embedded polymer waveguide board between two electrical printed circuit boards

Hyun-Shik Lee, Shinmo An, Beom Hoan O, Seung-Gol Lee, El-Hang Lee

Author Affiliations +

Proceedings Volume 6124, Optoelectronic Integrated Circuits VIII; 61241A (2006) https://doi.org/10.1117/12.650100
Event: Integrated Optoelectronic Devices 2006, 2006, San Jose, California, United States

Abstract

We designed and fabricated an optical-electrical printed circuit board, which we call OE-PCB, by laminating a board of embedded polymer waveguide arrays between two electrical printed circuit boards. The polymer waveguide arrays are molded by embossing technique using a specially designed silicon mold, which can form the optical waveguide arrays and the 45 degree mirrors concurrently. The integrated silicon molds are fabricated by dry etching or wet etching. The layers of the waveguide arrays are sandwiched and laminated between the upper and the lower electrical PCBs to form the OE-PCBs.

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Hyun-Shik Lee, Shinmo An, Beom Hoan O, Seung-Gol Lee, and El-Hang Lee "Fabrication of an optical-electrical printed circuit board (OE-PCB) by double-side lamination of an embedded polymer waveguide board between two electrical printed circuit boards", Proc. SPIE 6124, Optoelectronic Integrated Circuits VIII, 61241A (3 March 2006); https://doi.org/10.1117/12.650100

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