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3 March 2006 Fabrication of an optical-electrical printed circuit board (OE-PCB) by double-side lamination of an embedded polymer waveguide board between two electrical printed circuit boards
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Abstract
We designed and fabricated an optical-electrical printed circuit board, which we call OE-PCB, by laminating a board of embedded polymer waveguide arrays between two electrical printed circuit boards. The polymer waveguide arrays are molded by embossing technique using a specially designed silicon mold, which can form the optical waveguide arrays and the 45 degree mirrors concurrently. The integrated silicon molds are fabricated by dry etching or wet etching. The layers of the waveguide arrays are sandwiched and laminated between the upper and the lower electrical PCBs to form the OE-PCBs.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hyun-Shik Lee, Shinmo An, Beom Hoan O, Seung-Gol Lee, and El-Hang Lee "Fabrication of an optical-electrical printed circuit board (OE-PCB) by double-side lamination of an embedded polymer waveguide board between two electrical printed circuit boards", Proc. SPIE 6124, Optoelectronic Integrated Circuits VIII, 61241A (3 March 2006); https://doi.org/10.1117/12.650100
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