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Ultra-high-speed transmission of polymer-based multimode interference devices for board-level high-throughput optical interconnects
Development of a fabrication technology for integrating low cost optical interconnects on a printed circuit board
Advanced packaging materials for optical applications: bridging the gap between nm-size structures and large-area panel processing
Three-dimensional chip-scale optical interconnects and switches with self-organized wiring based on device-embedded waveguide films and molecular nanotechnologies
A novel free-space optical interconnect employing vertical-cavity surface emitting laser diodes and InGaAs metal-semiconductor-metal photodetectors for Gbit/s RF/microwave systems
Edge termination effects on finite aperture polarizers for polarimetric imaging applications at mid-wave IR
Fabrication of a hybrid electrical-optical printed circuit board (EO-PCB) by lamination of an optical printed circuit board (O-PCB) and an electrical printed circuit board (E-PCB)