28 February 2006 Low-cost plastic micro-optics for board-level optical interconnections
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Abstract
One of the grand challenges in solving the interconnection bottlenecks at the Printed Circuit Board (PCB) and Multi-Chip-Module (MCM) level, is to adequately replace the PCB and intra-MCM galvanic interconnects with high-performance, low-cost, compact and reliable micro-photonic alternatives. In our labs at the Vrije Universiteit Brussel we are therefore focusing on the continuous development of a rapid prototyping technology for micro-optical interconnect modules, which we call Deep Proton Writing (DPW).The special feature of this prototyping technology is that it is compatible with commercial low-cost mass replication techniques such as micro injection moulding and hot embossing. We will address more specifically in this paper the following components: 1) out-of-plane couplers for optical wave-guides embedded in PCB, 2) peripheral fiber ribbons and two dimensional single- and multimode fiber connectors for high-speed parallel optical connections, and 3) intra-MCM level optical interconnections via free-space optical modules. We furthermore give special attention to the optical tolerancing and the opto-mechanical integration of the components. We use both a sensitivity analysis to misalignment errors and Monte Carlo simulations. It is our aim to investigate the whole component integration chain from the optoelectronic device to the micro-opto-mechanical components constituting the interconnect module.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
C. Debaes, C. Debaes, M. Vervaeke, M. Vervaeke, B. Volckaerts, B. Volckaerts, J. Van Erps, J. Van Erps, L. Desmet, L. Desmet, H. Ottevaere, H. Ottevaere, P. Vynck, P. Vynck, V. Gomez, V. Gomez, A. Hermanne, A. Hermanne, H. Thienpont, H. Thienpont, } "Low-cost plastic micro-optics for board-level optical interconnections", Proc. SPIE 6126, Photonics Packaging and Integration VI, 61260M (28 February 2006); doi: 10.1117/12.660141; https://doi.org/10.1117/12.660141
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