22 February 2006 High-power LED arrays: special requirements on packaging technology
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Abstract
The market for high power LED solutions is expanding rapidly with the significant efficiency increase of LED chips. This revolutionizes the optoelectronics market, enabling engineers to use LEDs for general lighting applications as well as medical, specialty lighting and automotive solutions, where previously less efficient technologies had to be used. In order to reap the benefits of high power LEDs, however, special requirements concerning thermal management and optomechanical layout have to be met. We will show concepts of thermal management and technological solutions for the choice of different materials and assembly. Furthermore, we will discuss the gain and challenges of chip-on-board solutions using intelligent optical design in specific applications.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Oliver Kückmann, "High-power LED arrays: special requirements on packaging technology", Proc. SPIE 6134, Light-Emitting Diodes: Research, Manufacturing, and Applications X, 613404 (22 February 2006); doi: 10.1117/12.646321; https://doi.org/10.1117/12.646321
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