9 June 2006 Interferometric techniques applied in packaged MEMS and MOEMS measurement
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Proceedings Volume 6149, 2nd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies; 614901 (2006) https://doi.org/10.1117/12.674188
Event: 2nd International Symposium on Advanced Optical Manufacturing and Testing Technologies, 2005, Xian, China
Abstract
In this paper, first of all improved techniques are described to measure packaged MEMS or MOEMS surfaces through- transmissive-media (TTM) at higher magnifications. Secondly, a universal housing is presented for TTM-objective line and for different material and thickness of glass. Finally, the measurement results for low and high magnifications will be given for dispersion-compensated objectives, as well as some MEMS application examples.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sen Han, Sen Han, } "Interferometric techniques applied in packaged MEMS and MOEMS measurement", Proc. SPIE 6149, 2nd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 614901 (9 June 2006); doi: 10.1117/12.674188; https://doi.org/10.1117/12.674188
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