22 March 2006 First performance results of the ASML alpha demo tool
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Proceedings Volume 6151, Emerging Lithographic Technologies X; 615108 (2006); doi: 10.1117/12.657348
Event: SPIE 31st International Symposium on Advanced Lithography, 2006, San Jose, California, United States
Abstract
The ASML EUV alpha demo tool is operational! The alpha demo tool is a 0.25NA fully functional lithography tool with a field size of 26×33 mm2, enabling process development at the 40-nm technology node. In this paper we describe the tool performance, show that vacuum is achieved in a few hours, and demonstrate that our optics contamination strategy mitigates degradation of the optics. Additional data shows the Sn source cost-of-ownership to be comparable to state-of-the-art ArF source systems, by implementing a collector contamination mitigation strategy that includes cleaning. And, we present our first 35-nm dense lines and spaces (half pitch) resist images.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hans Meiling, Henk Meijer, Vadim Banine, Roel Moors, Rogier Groeneveld, Harm-Jan Voorma, Uwe Mickan, Bas Wolschrijn, Bas Mertens, Gregor van Baars, Peter Kürz, Noreen Harned, "First performance results of the ASML alpha demo tool", Proc. SPIE 6151, Emerging Lithographic Technologies X, 615108 (22 March 2006); doi: 10.1117/12.657348; https://doi.org/10.1117/12.657348
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KEYWORDS
Extreme ultraviolet

Reticles

Semiconducting wafers

Mirrors

Tin

Extreme ultraviolet lithography

Metrology

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