Impact of multi-layer deposition method on defects for EUVL photomask blanks

Jerry Cullins; Kumi Motai; Iwao Nisiyama

doi:10.1117/12.656931

23 March 2006 Impact of multi-layer deposition method on defects for EUVL photomask blanks

Jerry Cullins, Kumi Motai, Iwao Nisiyama

Proceedings Volume 6151, Emerging Lithographic Technologies X; 61511X (2006) https://doi.org/10.1117/12.656931
Event: SPIE 31st International Symposium on Advanced Lithography, 2006, San Jose, California, United States

Abstract

This paper is a summary of the work to date done by the ASET consortia to look at the impact of deposition method on defects. The study includes scratch and bump type defects coated with EUVL quality multi-layers using Magnetron Sputtering, Ion Beam Sputtering, or Ion Beam Sputtering with a secondary ion etch. After the deposition TEM samples were taken of the individual defects and the impact of the deposition method on the multi-layers was examined.

Citation Download Citation

Jerry Cullins, Kumi Motai, and Iwao Nisiyama "Impact of multi-layer deposition method on defects for EUVL photomask blanks", Proc. SPIE 6151, Emerging Lithographic Technologies X, 61511X (23 March 2006); https://doi.org/10.1117/12.656931

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