23 March 2006 Impact of multi-layer deposition method on defects for EUVL photomask blanks
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Abstract
This paper is a summary of the work to date done by the ASET consortia to look at the impact of deposition method on defects. The study includes scratch and bump type defects coated with EUVL quality multi-layers using Magnetron Sputtering, Ion Beam Sputtering, or Ion Beam Sputtering with a secondary ion etch. After the deposition TEM samples were taken of the individual defects and the impact of the deposition method on the multi-layers was examined.
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Jerry Cullins, Jerry Cullins, Kumi Motai, Kumi Motai, Iwao Nisiyama, Iwao Nisiyama, } "Impact of multi-layer deposition method on defects for EUVL photomask blanks", Proc. SPIE 6151, Emerging Lithographic Technologies X, 61511X (23 March 2006); doi: 10.1117/12.656931; https://doi.org/10.1117/12.656931
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