Embedded charge investigation: industry concerns and metrology solutions

Eric Solecky; Georgios Vakas; Chas Archie; Ofer Adan; Asaf Dajczman; Roger Cornell; Paul Llanos

doi:10.1117/12.660214

10 March 2006 Embedded charge investigation: industry concerns and metrology solutions

Eric Solecky, Georgios Vakas, Chas Archie, Ofer Adan, Asaf Dajczman, Roger Cornell, Paul Llanos

Proceedings Volume 6152, Metrology, Inspection, and Process Control for Microlithography XX; 615203 (2006) https://doi.org/10.1117/12.660214
Event: SPIE 31st International Symposium on Advanced Lithography, 2006, San Jose, California, United States

Abstract

As described by the ITRS roadmap [1], introduction of next generation processes in semiconductor fabrication continually requires tighter control in order to insure optimal device characteristics. Recent process development has shown an increased amount of charged layers, which in turn affects the inline critical dimension scanning electron microscope's (CD-SEM) ability to generate quality measurements thereby impacting process control. This paper reports on the investigation of techniques to measure and compensate for this charge dynamically to yield quality measurements. New capabilities of the CD-SEM were evaluated and tested at various process steps including processing steps not measured by the CD SEM. This capability not only means the CD-SEMs are essentially immune to charged layer affects but the capability can also be used to feedback to other tool-sets suspected of causing the charge build-up. These charge measurements help provide an understanding on how the device performance might be impacted. In order to establish charged wafer monitoring in the future along with feedback loops, studies of the reproducibility and the persistency of the charge across sequential processes in the back-end layers have been made. Studies were also conducted to determine the origin of the charge by observing the distribution before and after known problematic process steps.

Citation Download Citation

Eric Solecky, Georgios Vakas, Chas Archie, Ofer Adan, Asaf Dajczman, Roger Cornell, and Paul Llanos "Embedded charge investigation: industry concerns and metrology solutions", Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 615203 (10 March 2006); https://doi.org/10.1117/12.660214

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available