Yield enhancement methodologies for 90-nm technology and beyond

John Allgair; Todd Carey; James Dougan; Tony Etnyre; Nate Langdon; Brooke Murray

doi:10.1117/12.656616

24 March 2006 Yield enhancement methodologies for 90-nm technology and beyond

John Allgair, Todd Carey, James Dougan, Tony Etnyre, Nate Langdon, Brooke Murray

Proceedings Volume 6152, Metrology, Inspection, and Process Control for Microlithography XX; 615208 (2006) https://doi.org/10.1117/12.656616
Event: SPIE 31st International Symposium on Advanced Lithography, 2006, San Jose, California, United States

Abstract

In order to stay competitive in the rapidly advancing international semiconductor industry, a manufacturing company needs to continually focus on several areas including rapid yield learning, manufacturing cost, statistical process control limits, process yield, equipment availability, cycle time, turns per direct labor hour, customer on time delivery and zero customer defects. To hold a competitive position in the semiconductor market, performance to these measurable factors mut be maintained regardless of the technology generation. In this presentation, the methodology applied by Freescale Semiconductor to achieve the fastest yield learning curve in the industry, as cited by Dr. Robert Leachman of UC Berkley in 2003, will be discussed.

Citation Download Citation

John Allgair, Todd Carey, James Dougan, Tony Etnyre, Nate Langdon, and Brooke Murray "Yield enhancement methodologies for 90-nm technology and beyond", Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 615208 (24 March 2006); https://doi.org/10.1117/12.656616

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