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24 March 2006 Yield enhancement methodologies for 90-nm technology and beyond
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Abstract
In order to stay competitive in the rapidly advancing international semiconductor industry, a manufacturing company needs to continually focus on several areas including rapid yield learning, manufacturing cost, statistical process control limits, process yield, equipment availability, cycle time, turns per direct labor hour, customer on time delivery and zero customer defects. To hold a competitive position in the semiconductor market, performance to these measurable factors mut be maintained regardless of the technology generation. In this presentation, the methodology applied by Freescale Semiconductor to achieve the fastest yield learning curve in the industry, as cited by Dr. Robert Leachman of UC Berkley in 2003, will be discussed.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John Allgair, Todd Carey, James Dougan, Tony Etnyre, Nate Langdon, and Brooke Murray "Yield enhancement methodologies for 90-nm technology and beyond", Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 615208 (24 March 2006); https://doi.org/10.1117/12.656616
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