Paper
27 March 2006 Advanced DFM applications using design-based metrology on CD SEM
G. F. Lorusso, L. Capodieci, D. Stoler, B. Schulz, S. Roling, J. Schramm, C. Tabery, K. Shah, B. Singh, G. Abbott, A. Roberts, A. Azordegan, L. Heinrichs, Z. Kaliblotzky, E. Castel
Author Affiliations +
Abstract
Design Based Metrology (DBM) implements a novel automation flow, which allows for a direct and traceable correspondence to be established between selected locations in product designs and matching metrology locations on silicon wafers. Thus DBM constitutes the fundamental enabler of Design For Manufacturability (DFM), because of its intrinsic ability to characterize and quantify the discrepancy between design layout intent and actual patterns on silicon. The evolution of the CDSEM into a DFM tool, capable of measuring thousands of unique sites, includes 3 essential functionalities: (1) seamless integration with design layout and locations coordinate system; (2) new design-based pattern recognition and (3) fully automated recipe generation. Additionally advanced SEM metrology algorithms are required for complex 2-dimensional features, Line-Edge-Roughness (LER), etc. In this paper, we consider the overall DBM flow, its integration with traditional CDSEM metrology and the state-of-the-art in recipe automation success. We also investigate advanced DFM applications, specifically enabled by DBM, particularly for OPC model calibration and verification, design-driven RET development and parametric Design Rule evaluation and selection.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
G. F. Lorusso, L. Capodieci, D. Stoler, B. Schulz, S. Roling, J. Schramm, C. Tabery, K. Shah, B. Singh, G. Abbott, A. Roberts, A. Azordegan, L. Heinrichs, Z. Kaliblotzky, and E. Castel "Advanced DFM applications using design-based metrology on CD SEM", Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 61520B (27 March 2006); https://doi.org/10.1117/12.674776
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Cited by 1 scholarly publication and 4 patents.
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KEYWORDS
Semiconducting wafers

Metrology

Optical proximity correction

Pattern recognition

Design for manufacturing

Scanning electron microscopy

Calibration

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