Paper
24 March 2006 Characterizing optical proximity effect difference among exposure tools
Author Affiliations +
Abstract
In terms of mass production, the CD variation between exposure tools is not avoidable because of different exposure tool characteristics. The major CD variation is coming from different optical proximity effect (OPE) response between exposure tools. Knowing and control the major contributor to the OPE, ramping up the device will be faster because of one reticle usage in various exposure tools. Therefore, the quantitative measurement and simulation with actual exposure tool characteristics need for analyzing proximity impact to CD. For this purpose, collecting CD data on the wafers and analyzing was carried out to find large ID bias exposure tool. Normal and abnormal exposure tool in terms of proximity matching is inspected using LITEL products of ISITM(In-situ Interferometer) and SMITM(Source Metrology Interferometer). ISITM and SMITM were for collecting machine characteristic and Solid-ETM was for simulation purposes. From this study, the practical procedure is proposed to prevent using of large proximity exposure tool for production line and the impact of actual tools characteristic on proximity matching is known.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jongkyun Hong, Jeonkyu Lee, Eunsuk Kang, Hyunjo Yang, Donggyu Yim, and Jinwoong Kim "Characterizing optical proximity effect difference among exposure tools", Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 61522N (24 March 2006); https://doi.org/10.1117/12.656918
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Fiber optic illuminators

Critical dimension metrology

Semiconducting wafers

Inspection

Interferometers

Metrology

Reticles

RELATED CONTENT

Advanced gate CDU control in sub 28nm node using poly...
Proceedings of SPIE (April 10 2013)
Realizing "value-added" metrology
Proceedings of SPIE (April 05 2007)
Monitoring strategy to match the advanced fabs
Proceedings of SPIE (June 02 2004)
Photomask film degradation effects in the wafer fab how...
Proceedings of SPIE (November 08 2012)

Back to Top