Translator Disclaimer
Paper
24 March 2006 An in-line image quality monitoring system for imaging device fabrication using automated macro-inspection
Author Affiliations +
Abstract
An in-line image quality monitoring system using automated macro-inspection is described. One of the critical problems in reducing yield in CCD manufacture is the production of mura, regions of uneven sensitivity in the device. In this paper, an in-line mura-related yield monitor is presented using the recently developed Tokyo Aircraft Instrument Company EDIS-3000 Automated Macro-Inspection system, which has a high sensitivity and a high resolution optical module developed by IBMTM Japan. The optical module is designed to focus on reflected light from the pattern edge, not on the traditional diffracted light, so it is expected to register the linearity between the wafer CD and the wafer image. This system is expected to reduce yield loss, resulting in a faster time-to-market for imaging devices.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tohru Sasaki, Kunihiko Hikichi, Dai Sugimoto, Nozomu Izumi, Mitsuru Uda, Atsushi Kohayase, and Hiroshi Yamashita "An in-line image quality monitoring system for imaging device fabrication using automated macro-inspection", Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 61522W (24 March 2006); https://doi.org/10.1117/12.656151
PROCEEDINGS
10 PAGES


SHARE
Advertisement
Advertisement
Back to Top