24 March 2006 Overlay improvement by using new framework of grid compensation for matching
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Abstract
Overlay accuracy is a key issue in the semiconductor manufacturing process. To achieve overlay requirements, we developed compensation functions, i.e. Enhanced Global Alignment (EGA), Super Distortion Matching (SDM), and Grid Compensation for Matching (GCM). These functions are capable to reduce all the components except local linear components caused by a wafer global deformation. In this paper we introduce a novel correction framework which includes new compensation function called Shot Correction by Grid Parameter; thereby enabling further enhancements to overlay. Using this novel framework, we show both simulation and experimental data demonstrating improved overlay accuracy.
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Ayako Sukegawa, Shinji Wakamoto, Shinichi Nakajima, Masaharu Kawakubo, Nobutaka Magome, "Overlay improvement by using new framework of grid compensation for matching", Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 61523A (24 March 2006); doi: 10.1117/12.656876; https://doi.org/10.1117/12.656876
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