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24 March 2006 Improving scanner productivity and control through innovative connectivity application
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Abstract
Overlay accuracy is a key issue in semiconductor manufacturing process. In the ITRS roadmap also, overlay budgets are being reduced at a rapid pace. Coupled with the decreasing technology node budget allowances, alternative processing techniques are also driving overlay budgets to shrink. To meet those requirements, high order modeling of overlay error is potentially an effective solution. One source of overlay error is distortion matching between exposure tools. Matching can be broken down in to 2 areas; grid (stage related) and distortion (lens related). By using high order modeling of grid and distortion matching, we have been able to show overlay improvement of up to 50%. KLA-Tencor and Nikon are planning to provide automatic feedback system of high order compensation to exposure tool directly from metrology results. This feedback system can provide adjustment of coefficients of grid and distortion for periodical maintenance. Automating this process will lead to not only improved overlay control but also improved exposure tool productivity.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yuuki Ishii, Shinji Wakamoto, Atsuhiko Kato, and Brad Eichelberger "Improving scanner productivity and control through innovative connectivity application", Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 615247 (24 March 2006); https://doi.org/10.1117/12.656094
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