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24 March 2006 Low-pressure drop airborne molecular contaminant filtration using open-channel networks
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Airborne molecular contamination (AMC) continues to play a very decisive role in the performance of many microelectronic devices and manufacturing processes. Currently, the state of the filtration industry is such that optimum filter life and removal efficiency for AMC is offered by granular filter beds. However, the attributes that make packed beds of adsorbents extremely efficient also impart issues related to elevated filter weight and pressure drop. Most of the low pressure drop AMC filters currently offered tend to be quiet costly and contaminant nonspecific. Many of these low pressure drop filters are simply pleated combinations of various adsorptive and reactive media. On the other hand, low pressure drop filters, such as those designed as open-channel networks (OCNs), can still offer good filter life and removal efficiency, with the additional benefits of significant reductions in overall filter weight and pressure drop. Equally important for many applications, the OCN filters can reconstruct the airflow so as to enhance the operation of a tool or process. For tool mount assemblies and full fan unit filters this can result in reduced fan and blower speeds, which subsequently can provide reduced vibration and energy costs. Additionally, these low pressure drop designs can provide a cost effective way of effectively removing AMC in full fab (or HVAC) filtration applications without significantly affecting air-handling requirements. Herein, we will present a new generation of low pressure drop OCN filters designed for AMC removal in a wide range of applications.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Andrew J. Dallas, Lefei Ding, Jon Joriman, Dustin Zastera, Kevin Seguin, and James Empson "Low-pressure drop airborne molecular contaminant filtration using open-channel networks", Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 61524M (24 March 2006);

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