29 March 2006 The suppression method of powder formation in ArF photoresist
Author Affiliations +
Abstract
Powder formation of ArF photoresist in nozzle tip of track is very serious problem because particles of photoresist drop on wafer during process. To cope with this issue, we have studied several factors affecting powder formation in ArF photoresist processing such as polymer type, solvent for photoresist, thinner for solvent bath, and the structure of solvent bath. This report shows solutions for this issue. Chemical structure of polymer in ArF photoresist is the origin of powder formation but solvents for photoresist and thinner for solvent bath have an important role for improvement. Above all, the modification of solvent bath structure is most effective to remove this issue.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Geunsu Lee, Heesung Kim, Eungsok Lee, Myoungsoo Kim, Samyoung Kim, Cheolkyu Bok, Hyeongsoo Kim, Seungchan Moon, Jinwoong Kim, "The suppression method of powder formation in ArF photoresist", Proc. SPIE 6153, Advances in Resist Technology and Processing XXIII, 61533F (29 March 2006); doi: 10.1117/12.656860; https://doi.org/10.1117/12.656860
PROCEEDINGS
7 PAGES


SHARE
Back to Top