Paper
29 March 2006 Performance comparison of chemically amplified resists under EUV, EB, and KrF exposure
Daisuke Shimizu, Nobuji Matsumura, Toshiyuki Kai, Yoshikazu Yamaguchi, Tsutomu Shimokawa, Koichi Fujiwara
Author Affiliations +
Abstract
EUV exposure is crucial to evaluate EUV resists but there are currently a limited number of EUV exposure tools available worldwide. Therefore, an alternative exposure method should be considered to accelerate EUV resist development. To design materials for EUV resist, it is useful to identify and characterize acid generation mechanisms under EUV exposure. To do this, a performance comparison under EUV, EB and KrF exposure was performed to gather information about the acid generation mechanism during EUV exposure. In this paper, the performance of chemically amplified resists under EUV, EB and KrF was compared regarding sensitivity, LWR and pattern-profile not only to consider alternative exposure methods but also to elucidate the acid generation mechanism under EUV exposure. Regarding sensitivity, good correlation was observed between EUV and EB exposure, however, in regard to LWR and resist pattern profile, poor correlation was observed between EUV and EB exposure, and between EUV and KrF exposure. As a result, alternative exposure methods could be used only for basic evaluation and it was determined that EUV exposure was necessary for EUV resist development using chemically amplified resist. From the correlation of sensitivity between EUV and EB exposure, it is suggested that the main acid generation mechanism under EUV exposure was ionization.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Daisuke Shimizu, Nobuji Matsumura, Toshiyuki Kai, Yoshikazu Yamaguchi, Tsutomu Shimokawa, and Koichi Fujiwara "Performance comparison of chemically amplified resists under EUV, EB, and KrF exposure", Proc. SPIE 6153, Advances in Resist Technology and Processing XXIII, 615344 (29 March 2006); https://doi.org/10.1117/12.656097
Lens.org Logo
CITATIONS
Cited by 3 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Extreme ultraviolet lithography

Line width roughness

Chemically amplified resists

Photoresist materials

Extreme ultraviolet

Lithography

Ionization

Back to Top