Paper
29 March 2006 Evaluation of most recent chemically amplified resists for high resolution direct write using a Leica SB350 variable shaped beam writer
Anatol Schwersenz, Dirk Beyer, Monika Boettcher, Kang-Hoon Choi, Ulrich Denker, Christoph Hohle, Mathias Irmscher, Frank-Michael Kamm, Karl-Heinz Kliem, Johannes Kretz, Holger Sailer, Frank Thrum
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Abstract
E-beam direct writing, one node ahead of advanced optical lithography, can be a time and cost effective option for early device and technology development as well as for fast prototyping. Because of the device complexity only a variable-shaped e-beam writer combined with sensitive chemically amplified resists (CAR) can be considered for this approach. We evaluated various pCARs and nCARs of all major suppliers for our goal to structure DRAMs of the 50nm node using the Leica SB350 e-beam writer. The most promising samples were selected for a process optimization by variation of bake and development conditions. Finally, one resist of each tonality met the most of our specifications like dense lines and contact holes resolution, sensitivity and vacuum stability.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Anatol Schwersenz, Dirk Beyer, Monika Boettcher, Kang-Hoon Choi, Ulrich Denker, Christoph Hohle, Mathias Irmscher, Frank-Michael Kamm, Karl-Heinz Kliem, Johannes Kretz, Holger Sailer, and Frank Thrum "Evaluation of most recent chemically amplified resists for high resolution direct write using a Leica SB350 variable shaped beam writer", Proc. SPIE 6153, Advances in Resist Technology and Processing XXIII, 615347 (29 March 2006); https://doi.org/10.1117/12.655497
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Cited by 2 scholarly publications.
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KEYWORDS
Photomasks

Semiconducting wafers

Optical lithography

Chemically amplified resists

Photoresist processing

Electron beam lithography

Beam shaping

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