DOF enhancement for contact holes by using Nikon's CDP option and its introduction into production

Louis-Pierre Armellin; Virginie Dureuil; Laurent Nuel; Vincent Salvetat; Winfried Meier; Andreas Kraft

doi:10.1117/12.656522

15 March 2006 DOF enhancement for contact holes by using Nikon's CDP option and its introduction into production

Louis-Pierre Armellin, Virginie Dureuil, Laurent Nuel, Vincent Salvetat, Winfried Meier, Andreas Kraft

Proceedings Volume 6154, Optical Microlithography XIX; 61542B (2006) https://doi.org/10.1117/12.656522
Event: SPIE 31st International Symposium on Advanced Lithography, 2006, San Jose, California, United States

Abstract

Historically the primary methods used to achieve the industries ever-tightening resolution requirements were reduction of exposure wavelength and increased projection lens NA. Today however, photo engineers are pushing optical lithography well beyond the realm of what was once considered practical. Specific scanner exposure tool features have to be implemented to achieve the aggressive imaging objectives. One such example is to use focus drilling to expand the depth of focus for contact layers. This paper describes the implementation of focus drilling through the Continuous DOF expansion Procedure (CDP). In CDP, the wafer is tilted along the scanning direction, while the wafer stage continuously moves upward or downward during exposure. CDP technology provides an enhanced process window with initial data showing a 30% improvement in DOF for 250-nm contact holes. It also eliminates the need for double exposures and therefore maintains high throughput, comparable to standard wafer exposure.

Citation Download Citation

Louis-Pierre Armellin, Virginie Dureuil, Laurent Nuel, Vincent Salvetat, Winfried Meier, and Andreas Kraft "DOF enhancement for contact holes by using Nikon's CDP option and its introduction into production", Proc. SPIE 6154, Optical Microlithography XIX, 61542B (15 March 2006); https://doi.org/10.1117/12.656522

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