26 April 2006 Influence of the intermetallic compounds on the reliability of solder joints
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Proceedings Volume 6159, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments IV; 61591V (2006) https://doi.org/10.1117/12.675094
Event: Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments IV, 2005, Wilga, Poland
Abstract
Intermetallic compounds (IMC) can not be disregard during consideration referred to the reliability of solder joints. In connection with removing lead from consumer electronics, the reliability of the Pb-free solders seems to be a crucial and worth of attention problem. Occurance of the IMC may significantly cut down the up time of interconnection causing that solder joint cracks easily. The influence of the IMC on the reliability of solder joints depends on properties of the IMC and reactions between the IMC and both boundary layers and solder mass. The IMC is not the only factor which has an effect on the reliability of solder joints. The others are for example soldering conditions, composition of alloys and layers, appearance of specific multilayers and correlations between them. In this study considerations are focused only on the IMC problems. Interfacial reactions, specific ripening of IMC and a long range interactions will be presented and explained.
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Przemyslaw Matkowski, "Influence of the intermetallic compounds on the reliability of solder joints", Proc. SPIE 6159, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments IV, 61591V (26 April 2006); doi: 10.1117/12.675094; https://doi.org/10.1117/12.675094
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