High-precision and high-speed laser microjoining for electronics and microsystems

Arnold Gillner; Alexander Olowinsky; Kilian Klages; Jens Gedicke; Fahri Sari

doi:10.1117/12.674979

26 April 2006 High-precision and high-speed laser microjoining for electronics and microsystems

Arnold Gillner, Alexander Olowinsky, Kilian Klages, Jens Gedicke, Fahri Sari

Proceedings Volume 6161, International Conference on Lasers, Applications, and Technologies 2005: Laser-Assisted Micro- and Nanotechnologies; 616102 (2006) https://doi.org/10.1117/12.674979
Event: International Conference on Lasers, Applications, and Technologies 2005, 2005, St. Petersburg, Russian Federation

Abstract

The joining processes in electronic device manufacturing are today still dominated by conventional joining techniques like press fitting, crimping and resistance welding. Laser beam joining techniques have been under intensive investigations and subsequently new processes for mass manufacturing and high accuracy assembling were established. With the newly developed SHADOW^(R) welding technology technical aspects such as tensile strength, geometry and precision of the weld could be improved. This technology provides highest flexibility in weld geometry with a minimum welding time as well as new possibilities in using application adapted materials. Different parts and even different metals can be joined by a non-contact process. The application of a relative movement between the laser beam and the part to be joined at feed rates of up to 60 m/min produces weld seams with a length from 0.6 mm to 15.7 mm using a pulsed Nd:YAG laser with a pulse duration of up to 50 ms. Due to the low energy input, typically 1 J to 6 J, a weld width as small as 50 μm and a weld depth as small as 20 pm have been attained. This results in low distortion of the joined watch components. Within this paper this new welding process will be explained and several examples of joined components will be presented with respect to fundamentals and the sustainable implementation of the SHADOW^(R) welding technique into watch manufacturing and electronic industry. For microsystem applications the laser joining technology is modified to join even silicon and glass parts without any melting based on the formation of a thermally induced oxygen bond. New fields of applications for joining different materials such as steel to brass or steel to copper for electrical interconnects will be discussed. Here the SHADOW^(R) welding technique offers new possibilities for the combination of good electrical properties of copper with high mechanical stiffness of steel. The paper will give a closer look to microjoining applications especially using the SHADOW^(R) welding technique. Basics of the process as well as its application on dedicated examples will be shown for small parts such as axis-wheel combinations and electrical connectors.

Citation Download Citation

Arnold Gillner, Alexander Olowinsky, Kilian Klages, Jens Gedicke, and Fahri Sari "High-precision and high-speed laser microjoining for electronics and microsystems", Proc. SPIE 6161, International Conference on Lasers, Applications, and Technologies 2005: Laser-Assisted Micro- and Nanotechnologies, 616102 (26 April 2006); https://doi.org/10.1117/12.674979

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