30 March 2006 Self-assembled Metal Rubber mechanical sensors
Author Affiliations +
Abstract
Molecular-level self-assembly processes allow the formation of novel materials with properties that are not achievable using conventional fabrication methods. For example, nanostructured metals and polymers may be combined to form inorganic/organic materials that exhibit properties typically associated with each of these species separately, namely high electrical conductivity and low Young's modulus. The combination of such properties is of interest for a number of engineering applications. For example, methods to form stretchable metal conductors, either on elastomeric substrates or as free-standing materials, have been investigated for some time, in part as a way to overcome the high modulus of sensor and actuator electrode materials, and more generally to address the need for mechanically flexible interconnections in polymer electronic devices, flex circuits, electronic textiles and similar electrical circuit applications. Of particular recent interest for example is summarized in [1] where a process to form electrical connectivity using 100 nm-wide gold stripes evaporated onto polydimethylsiloxane (PDMS) is reported, and where non-zero electrical conductivity was observed for strains up to 22%.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Richard O. Claus, Richard M. Goff, Jennifer H. Lalli, Andrea Hill, "Self-assembled Metal Rubber mechanical sensors", Proc. SPIE 6167, Smart Structures and Materials 2006: Smart Sensor Monitoring Systems and Applications, 616712 (30 March 2006); doi: 10.1117/12.658809; https://doi.org/10.1117/12.658809
PROCEEDINGS
4 PAGES


SHARE
RELATED CONTENT

Self-assembled nanostructured sensors
Proceedings of SPIE (July 27 2004)
Commercial applications of Metal Rubber
Proceedings of SPIE (May 05 2005)
Nanostructured materials produced by self-organized media
Proceedings of SPIE (November 13 2002)
Metal Rubber sensors
Proceedings of SPIE (May 16 2005)

Back to Top