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31 March 2006 A new device for characterization of mechanical stress caused by packaging processes
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Abstract
This paper reports on a new method for estimation and minimization of mechanical stress on MEMS sensor and actuator structures due to packaging processes based on flip chip technology. For studying mechanical stress a test chip with silicon diaphragms was fabricated. A network of piezo-resistive solid state resistors created by diffusion was used to measure the surface tension pattern between adjacent diaphragms. Finite element method simulation was used to calculate the stress profile and to determine the optimum positions for placing the resistive network.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Soeren Hirsch and Bertram Schmidt "A new device for characterization of mechanical stress caused by packaging processes", Proc. SPIE 6172, Smart Structures and Materials 2006: Smart Electronics, MEMS, BioMEMS, and Nanotechnology, 617210 (31 March 2006); https://doi.org/10.1117/12.659423
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