31 March 2006 Design and development of microstrip patch antenna at Ka-band using MEMS technology
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Abstract
This paper reports a Ka-band microstrip patch antenna fabricated using post-CMOS compatible process technology. The antenna uses an air cavity underneath the patch radiator that is supported on thin membrane. To start with, a thin dielectric film of silicon dioxide is deposited on <100> single crystal silicon substrates by RF sputtering process. The membrane is then realized using bulk micromachining technology. The antenna structure was analyzed and optimized using the finite-element method (FEM) based Ansoft High Frequency Structure Simulator software (version 9). The antenna structure mounted on a test jig with K-connector was used for testing its performance. The measured results of the fabricated prototype antenna agree quite closely with the simulated results. The fabricated antenna resonated at 36 GHz with -10 dB return loss bandwidth of 1.2 GHz. In the absence of access to well-established MEMS foundry, the RF sputtering process reported here can be advantageously used for rapid prototyping of many antenna structures.
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Preeti Sharma, Shiban K. Koul, Sudhir Chandra, "Design and development of microstrip patch antenna at Ka-band using MEMS technology", Proc. SPIE 6172, Smart Structures and Materials 2006: Smart Electronics, MEMS, BioMEMS, and Nanotechnology, 61721F (31 March 2006); doi: 10.1117/12.659030; https://doi.org/10.1117/12.659030
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KEYWORDS
Antennas

Dielectrics

Silicon

Sputter deposition

Etching

Ka band

Microelectromechanical systems

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