21 April 2006 A combined space-time multiplex architecture for a stacked smart sensor chip
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We present a fine-grain parallel processor architecture which considers particularly the requirements defined by future 3-dimensional (3D) stacked optoelectronic devices. The architecture concept is well-suited for novel detector arrays which are exploited in data communication applications based on high-speed VCSEL photonic interconnects as well as for optical sensing applications in smart CMOS camera chips. We assume the presence of a two-dimensional optoelectronic interface mounted on top of the stacked device. Such a vertical communication scheme is perfect for the realization of very compact and fast working devices in embedded systems, e.g. in gripper arms of robots.
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A. Loos, A. Loos, M. Schmidt, M. Schmidt, A. Graupner, A. Graupner, D. Fey, D. Fey, R. Schüffny, R. Schüffny, } "A combined space-time multiplex architecture for a stacked smart sensor chip", Proc. SPIE 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration, 61850H (21 April 2006); doi: 10.1117/12.662287; https://doi.org/10.1117/12.662287

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