MEMS as well as electronic components are used in the automotive, communication, aerospace and other industries. Miniaturization, higher package density and accelerated development processes have a great impact on the reliability of components. Rapid changes of ambient temperature or internal production of heat may occur during operation. This may create high thermal stresses due to the mismatch of the thermal expansion coefficients of the different materials in
electronic components. On the other side simulations (FEA,...) are used in the electronic industry, but the material parameters (coefficient of thermal expansion, young's modulus,...) have to been known. A validation of results is necessary. In some cases simulations are not possible, than the measurement precise deformation is necessary. The 3D electronic speckle interferometry is a very powerful tool to investigate the thermal expansion of MEMS and electronic components. Due to the full field measuring technique combined with a high resolution the determination of critical areas and hot spots in electronic components is very easy. The capability of this measuring technique will be shown on examples like the NDT testing of flip chips, thermal deformation of BGA and a yaw sensor.