18 April 2006 High speed experimental analysis of orthogonal planing using high speed infrared camera
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Proceedings Volume 6205, Thermosense XXVIII; 62050X (2006) https://doi.org/10.1117/12.667568
Event: Defense and Security Symposium, 2006, Orlando (Kissimmee), Florida, United States
Abstract
An experimental analysis of the orthogonal cutting process is presented. Machining experiments have been performed using advanced techniques. A high-speed camera is coupled with an infrared thermal measurement aid on a dynamic test bench. This continuously reveals the deformations occurring on the flank of a chip, and the infrared camera gives information on the variation of thermal radiation (see the pictures under the abstract). The challenge consists of understanding the effect of machinability improvement treatments on metallic materials.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Pierrick Guégan, Pierrick Guégan, Arnaud Poitou, Arnaud Poitou, Pierre Brémond, Pierre Brémond, } "High speed experimental analysis of orthogonal planing using high speed infrared camera", Proc. SPIE 6205, Thermosense XXVIII, 62050X (18 April 2006); doi: 10.1117/12.667568; https://doi.org/10.1117/12.667568
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