Paper
10 May 2006 Development and application of high-temperature sensors and electronics for propulsion applications
Gary W. Hunter, John D. Wrbanek, Robert S. Okojie, Philip G. Neudeck, Gustave C. Fralick, Liangyu Chen, Jennifer Xu, Glenn M. Beheim
Author Affiliations +
Abstract
High temperature sensors and electronics are necessary for a number of aerospace propulsion applications. The Sensors and Electronics Branch at NASA Glenn Research Center (NASA GRC) has been involved in the design, fabrication, and application of a range of sensors and electronics that have use in high temperature, harsh environment propulsion environments. The emphasis is on developing advanced capabilities for measurement and control of aeropropulsion systems as well as monitoring the safety of those systems using Micro/Nano technologies. Specific areas of work include SiC based electronic devices and sensors; thin film thermocouples, strain gauges, and heat flux gauges; chemical sensors; as well as integrated and multifunctional sensor systems. Each sensor type has its own technical challenges related to integration and reliability in a given application. These activities have a common goal of improving the awareness of the state of the propulsion system and moving towards the realization of intelligent engines. This paper will give an overview of the broad range of sensor-related development activities on-going in the NASA GRC Sensors and Electronics Branch as well as their current and potential use in propulsion systems.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gary W. Hunter, John D. Wrbanek, Robert S. Okojie, Philip G. Neudeck, Gustave C. Fralick, Liangyu Chen, Jennifer Xu, and Glenn M. Beheim "Development and application of high-temperature sensors and electronics for propulsion applications", Proc. SPIE 6222, Sensors for Propulsion Measurement Applications, 622209 (10 May 2006); https://doi.org/10.1117/12.668458
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KEYWORDS
Sensors

Electronics

Silicon carbide

Thin films

Environmental sensing

Field effect transistors

Packaging

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