18 May 2006 3D system architectures
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Abstract
The ever increasing demand for more electronic functionality integrated in silicon chips requires new approaches. One solution is to explore several technology fronts such as nanometer lithography or advanced materials. A better (but complementary) solution is to use the third dimension by stacking multiple layers of integrated circuits that overcomes the limitations of planar approaches. A general overview of 3D packaging and integration approaches is presented in relation to system architectures that will benefit from 3D implementation.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jonathan M. Stern, Jonathan M. Stern, Volkan H. Ozguz, Volkan H. Ozguz, } "3D system architectures", Proc. SPIE 6232, Intelligent Integrated Microsystems, 62320K (18 May 2006); doi: 10.1117/12.667381; https://doi.org/10.1117/12.667381
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