18 May 2006 3D system architectures
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The ever increasing demand for more electronic functionality integrated in silicon chips requires new approaches. One solution is to explore several technology fronts such as nanometer lithography or advanced materials. A better (but complementary) solution is to use the third dimension by stacking multiple layers of integrated circuits that overcomes the limitations of planar approaches. A general overview of 3D packaging and integration approaches is presented in relation to system architectures that will benefit from 3D implementation.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jonathan M. Stern, Jonathan M. Stern, Volkan H. Ozguz, Volkan H. Ozguz, } "3D system architectures", Proc. SPIE 6232, Intelligent Integrated Microsystems, 62320K (18 May 2006); doi: 10.1117/12.667381; https://doi.org/10.1117/12.667381

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