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7 June 2006 Laser propulsion of microelectronic components: releasing mechanism investigation
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Proceedings Volume 6261, High-Power Laser Ablation VI; 62612P (2006) https://doi.org/10.1117/12.673815
Event: High-Power Laser Ablation 2006, 2006, Taos, NM, United States
Abstract
Laser propulsion has gained increasing attention in the recent years. Ultra-high average power laser systems have emerged and found applications in launching satellites to the space. The impulse generated by ablation can also be used to move small parts. This article describes laser-induced releasing of microelectronic components from its carrier material. The releasing mechanisms can be divided in: ablative and thermal releasing, depending from polymers, which are used as the component's carrier material and whether low or high laser fluence is used. The directional variation and speed variations under different operating conditions were studied and presented. Application of this technique as a fast microelectronics components assembly method is demonstrated.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Natallia S. Karlitskaya, Johan Meijer, Dirk F. de Lange, and Henk Kettelarij "Laser propulsion of microelectronic components: releasing mechanism investigation", Proc. SPIE 6261, High-Power Laser Ablation VI, 62612P (7 June 2006); https://doi.org/10.1117/12.673815
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