GaAs array fabrication

D. H. Lumb; M. Bavdaz; D. Martin; A. Owens; A. Peacock; S. Nenonen; H. Andersson

doi:10.1117/12.671509

15 June 2006 GaAs array fabrication

D. H. Lumb, M. Bavdaz, D. Martin, A. Owens, A. Peacock, S. Nenonen, H. Andersson

Proceedings Volume 6276, High Energy, Optical, and Infrared Detectors for Astronomy II; 627614 (2006) https://doi.org/10.1117/12.671509
Event: SPIE Astronomical Telescopes + Instrumentation, 2006, Orlando, Florida , United States

Abstract

The fabrication of GaAs diode arrays for X-ray imaging spectroscopy applications is described. Special attention is paid to the processing of wafers and devices to allow integration with different readout Application Specific Integrated Circuits (ASICs) using flip-chip bump bonding techniques.

Citation Download Citation

D. H. Lumb, M. Bavdaz, D. Martin, A. Owens, A. Peacock, S. Nenonen, and H. Andersson "GaAs array fabrication", Proc. SPIE 6276, High Energy, Optical, and Infrared Detectors for Astronomy II, 627614 (15 June 2006); https://doi.org/10.1117/12.671509

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