15 June 2006 GaAs array fabrication
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Abstract
The fabrication of GaAs diode arrays for X-ray imaging spectroscopy applications is described. Special attention is paid to the processing of wafers and devices to allow integration with different readout Application Specific Integrated Circuits (ASICs) using flip-chip bump bonding techniques.
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D. H. Lumb, D. H. Lumb, M. Bavdaz, M. Bavdaz, D. Martin, D. Martin, A. Owens, A. Owens, A. Peacock, A. Peacock, S. Nenonen, S. Nenonen, H. Andersson, H. Andersson, "GaAs array fabrication", Proc. SPIE 6276, High Energy, Optical, and Infrared Detectors for Astronomy II, 627614 (15 June 2006); doi: 10.1117/12.671509; https://doi.org/10.1117/12.671509
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