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27 June 2006 The status of LEEPL: Can it be an alternative solution?
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Proceedings Volume 6281, 22nd European Mask and Lithography Conference; 628102 (2006)
Event: 22nd European Mask and Lithography Conference, 2006, Dresden, Germany
The concept of LEEPL is based on the discovery that there is a narrow energy space around 2KV of e-beam proximity lithography where a potential solution for NGL exists. [1] LEEPL Corporation and LEEPL Technology Consortium consisting of 32 companies have been formed in 2000 and 2001 respectively for the purpose of developing LEEPL technology. The development has been carried out by 1) building α-tool, 2×β-tools, a pre-production model (LEEPL-3000) and 2) by building the infrastructure supporting LEEPL technology such as development and supply of LEEPL masks, resist materials, mask inspection and repair tools. Here LEEPL's overall status and future prospect will be presented for the first time on the base of the past 5 years' intensive effort. The content of the presentation include LEEPL Development Overview, Exposure and Alignment Systems, Performance of Resolution, Resist Process, Throughput, and Cost of Ownership Comparison, and LEEPL Mask and Related Technologies. In conclusion the potential of LEEPL as an alternative solution for future semiconductor lithography beyond 45 nm node device application will be discussed.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Takao Utsumi "The status of LEEPL: Can it be an alternative solution?", Proc. SPIE 6281, 22nd European Mask and Lithography Conference, 628102 (27 June 2006);

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