20 May 2006 Automatic pitch decomposition for improved process window when printing dense features at k1eff<0.20
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Proceedings Volume 6283, Photomask and Next-Generation Lithography Mask Technology XIII; 62830T (2006) https://doi.org/10.1117/12.681853
Event: Photomask and Next Generation Lithography Mask Technology XIII, 2006, Yokohama, Japan
Abstract
In conventional IC processes, the smallest size of any features that can be created on a wafer is severely limited by the pitch of the processing system. This approach is a key enabler of printing mask features on wafers without requiring new manufacturing equipment and with minor changes to existing manufacturing processes. The approach also does not require restrictions on the design of the chip. This paper will discuss the method and full-chip decomposition tool used to determine locations to split the layout. It will demonstrate examples of over-constrained layouts and how these configurations are mitigated. It will also show the reticle enhancement techniques used to process the split layouts and the Lithographic Checking used to verify the lithographic results.
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Judy Huckabay, Judy Huckabay, Wolf Staud, Wolf Staud, Robert Naber, Robert Naber, Mircea Dusa, Mircea Dusa, Donis Flagello, Donis Flagello, Robert Socha, Robert Socha, } "Automatic pitch decomposition for improved process window when printing dense features at k1eff<0.20", Proc. SPIE 6283, Photomask and Next-Generation Lithography Mask Technology XIII, 62830T (20 May 2006); doi: 10.1117/12.681853; https://doi.org/10.1117/12.681853
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