Inverse Lithography Technology (ILT) is a rigorous approach to determine the mask shapes that produce the desired on-wafer
results. In this paper, we briefly describe an image (or pixel))-based implementation of ILT in comparison to OPC
technologies, which are usually edge-based. Such implementation is more computationally scalable and avoids laborious
segmentation script-writing, which becomes more complex for newer generations because of complicated proximity
effects. In this paper, we will give an overview of ILT, present some simulation and wafer examples to demonstrate the
benefit of ILT, clarify common myths about ILT, discuss and show examples to illustrate the impact in every step of the
mask making process. Specifically, studies done with several leading mask shops around the world on mask
manufacturability (including data fracturing, writing strategy and writing time, mask inspection), will be shown.