14 August 2006 Fast and accurate non-contact in situ optical metrology for end-point detection
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Proceedings Volume 6292, Interferometry XIII: Techniques and Analysis; 629211 (2006); doi: 10.1117/12.675342
Event: SPIE Optics + Photonics, 2006, San Diego, California, United States
Abstract
We present design of novel tool for end point detection of wafer thickness, and wafer topography employing low coherence fiber optic interferometer, which optical length of the reference arm of the interferometer is monitored by secondary long coherence length interferometer.
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Wojciech J. Walecki, Alexander Pravdivstev, Manuel Santos, Ann Koo, "Fast and accurate non-contact in situ optical metrology for end-point detection", Proc. SPIE 6292, Interferometry XIII: Techniques and Analysis, 629211 (14 August 2006); doi: 10.1117/12.675342; https://doi.org/10.1117/12.675342
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KEYWORDS
Semiconducting wafers

Mirrors

Scanners

Interferometers

Fiber optics

Coherence (optics)

Etching

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