14 August 2006 High-speed high-accuracy fiber optic low-coherence interferometry for in situ grinding and etching process monitoring
Author Affiliations +
Abstract
We present design of novel tool for characterization of wafer thickness and wafer topography employing fast low coherence fiber optic interferometer, which optical length of the reference arm of the interferometer is monitored by secondary long coherence length interferometer.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Wojciech J. Walecki, Wojciech J. Walecki, Alexander Pravdivtsev, Alexander Pravdivtsev, Manuel Santos, Manuel Santos, Ann Koo, Ann Koo, "High-speed high-accuracy fiber optic low-coherence interferometry for in situ grinding and etching process monitoring", Proc. SPIE 6293, Interferometry XIII: Applications, 62930D (14 August 2006); doi: 10.1117/12.675592; https://doi.org/10.1117/12.675592
PROCEEDINGS
5 PAGES


SHARE
RELATED CONTENT

Polarization role in fiber-optic interferometry
Proceedings of SPIE (August 01 2004)
Recent results from the IOTA interferometer
Proceedings of SPIE (July 23 1998)
Micro-Miniature Fiber-Optic Accelerometer
Proceedings of SPIE (December 02 1987)
Optical low-coherence tomography of bronchial tissue
Proceedings of SPIE (December 14 1999)

Back to Top