Paper
9 July 1986 Submicron Optical Lithography: Enhanced Resolution And Depth Of Focus Using Advanced Processing Materials And Process Optimization
Michele Nuhn, Sungmuk Lee
Author Affiliations +
Abstract
The system performance of the THE i-line 10X wafer stepper with the Zeiss prototype 0.315 NA lens has been reported in previous papers.1,2 This paper describes the enhanced optical properties achieved using advanced processing materials and process optimization. Theoretical verses actual resolution and depth of focus results will be presented using the following materials: Ciba Geigy i-line sensitive photoimagable polyimide, AZ52140 positive resist, Shipley S2400 and S1400 microposit resists and General Electric's contrast enhancement material 388. Submicron resolution was achieved using all of the aforementioned materials; 0.75 micron lines and spaces using Ciba Geigy photoimagable polyimide, 0.5 micron lines and spaces using AZ5214, S2400, and S1400 microposit resists, and 0.375 micron lines and spaces when GE contrast enhancement material 388 is used with positive photoresist. Modulation Transfer Curves (MTF) for the Zeiss 10 78 34 lens and the various resist films used will be constructed to explain these results. The theoretical depth of focus range was adhered to when using both positive resists and polyimide. Enhanced depth of focus was achieved using GE's contrast enhancement material 388 with the positive resists tested. The theoretical and actual image distortion effect at focus values outside the theoretical depth of focus range is examined and the impact of future lenses coupled with current process technologies will also be discussed.
© (1986) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Michele Nuhn and Sungmuk Lee "Submicron Optical Lithography: Enhanced Resolution And Depth Of Focus Using Advanced Processing Materials And Process Optimization", Proc. SPIE 0631, Advances in Resist Technology and Processing III, (9 July 1986); https://doi.org/10.1117/12.963635
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KEYWORDS
Image processing

Semiconducting wafers

Photoresist processing

Distortion

Modulation transfer functions

Photoresist materials

Materials processing

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