8 September 2006 Finite element analysis of thermoelastic damping in microelectromechanical systems (MEMS)
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Abstract
A finite element formulation is developed for solving the problem related to thermoelastic damping in MEMS beam resonators. The perturbation analysis on the governing equations of heat conduction, thermoleasticity and dynamic motion yields a linear eigenvalue equation for the exponential growth rate of nodal temperature, displacement and velocity. The numerical solutions for a simply supported beam have been obtained and compared to the analytical solutions found in literature, showing excellent agreements. The finite element formulation in this work has advantages over the existing analytical approaches in that the method can be easily extended to general three-dimensional geometries.
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Y.-B. Yi, Y.-B. Yi, M. A. Matin, M. A. Matin, "Finite element analysis of thermoelastic damping in microelectromechanical systems (MEMS)", Proc. SPIE 6310, Photonic Devices and Algorithms for Computing VIII, 63100T (8 September 2006); doi: 10.1117/12.679157; https://doi.org/10.1117/12.679157
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