29 August 2006 Thermal and mechanical joints to cryo-cooled silicon monochromator crystals
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Abstract
We describe the performance of various materials used as the thermal interface between silicon to silicon and silicon to copper joints when operated at ~120K and loaded with ~20 watts of thermal power. We find that only the indium based silicon-to-silicon joint is reliable.
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A. MacDowell, S. Fakra, G. Morrison, "Thermal and mechanical joints to cryo-cooled silicon monochromator crystals", Proc. SPIE 6317, Advances in X-Ray/EUV Optics, Components, and Applications, 63171F (29 August 2006); doi: 10.1117/12.697083; https://doi.org/10.1117/12.697083
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