Paper
31 August 2006 2D InP photonic crystal fabrication process development
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Abstract
We have developed a reliable process to fabricate high quality 2D air-hole and dielectric column InP photonic crystals with a high aspect ratio on a STS production tool using ICP N2+Cl2 plasma. The photonic crystals have a triangular lattice with lattice constant of 400 nm and air-hole and dielectric column radius of 120 nm. Large efforts have been devoted on developing a proper mask. We obtained a perfect, clean and vertical profiled SiNX mask. The next main effort is InP pattern transfer in Cl2+N2 plasma. Etching selectivity, smooth sidewall and etch profile are directly related to plasma process condition, besides the quality of SiNX mask. We have optimized the N2+Cl2 plasma condition to obtain high aspect ratio, vertical profile and smooth sidewall InP structures. Cylindrical holes (2 micron depth) and rodlike pillars (2.4 micron height) are uniformly fabricated. An aspect ratio of 18 for 100nm trench lines has been obtained. AFM measurement evidences that etched surfaces are smooth. The root mean square roughness of pillar and hole is 0.7 nm and 0.8 nm, respectively. The optical transmission characterization of ridge waveguides has been carried out. Transmission spectrum of 1 micron wide waveguide has been obtained.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Bifeng Rong, Emile van der Drift, Rob W. van der Heijden, and Huub W. M. Salemink "2D InP photonic crystal fabrication process development", Proc. SPIE 6327, Nanoengineering: Fabrication, Properties, Optics, and Devices III, 632715 (31 August 2006); https://doi.org/10.1117/12.680281
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Cited by 7 scholarly publications.
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KEYWORDS
Etching

Waveguides

Plasma

Chlorine

Photonic crystals

Plasma etching

Atomic force microscopy

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