Paper
20 August 1986 Impact Of 1X Reticle Defects For Submicron Production Lithography
K. L. Zollinger, C. P. O'Mahony, M. S. Chang
Author Affiliations +
Abstract
A new test reticle with programmed defects has been designed to evaluate the impact of 1X reticle defects for micron and submicron design rules. This reticle has been used to examine the performance of the present generation of automatic reticle inspection systems, as well as to investigate the printability of defects using a 1 um 1X lens. Printability of contact holes, shaped contacts, and pinholes have been compared. Conclusions relevant to the manufacture of 1X reticles for micron and submicron device work are presented here.
© (1986) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
K. L. Zollinger, C. P. O'Mahony, and M. S. Chang "Impact Of 1X Reticle Defects For Submicron Production Lithography", Proc. SPIE 0633, Optical Microlithography V, (20 August 1986); https://doi.org/10.1117/12.963711
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CITATIONS
Cited by 2 scholarly publications and 1 patent.
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KEYWORDS
Reticles

Semiconducting wafers

Inspection

Lithography

Inspection equipment

Optical lithography

Photoresist materials

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