Relative Alignment By Direct Wafer Detection Utilizing Rocking Illumination Of Ar Ion Laser

Yoshitada Oshida; Masataka Shiba; Atsuhiro Yoshizaki

doi:10.1117/12.963704

20 August 1986 Relative Alignment By Direct Wafer Detection Utilizing Rocking Illumination Of Ar Ion Laser

Yoshitada Oshida, Masataka Shiba, Atsuhiro Yoshizaki

Proceedings Volume 0633, Optical Microlithography V; (1986) https://doi.org/10.1117/12.963704
Event: 1986 Microlithography Conferences, 1986, Santa Clara, United States

Abstract

A new alignment system for micron and submicron lithography has been developed by Hitachi. Ar ion laser and charge coupled devices (CCD) are used in this system to detect the relative position of wafer and reticle. Each wafer mark on the scribe lines is directly detected through the reduction lens and kept in position till exposure is completed. Direct wafer detection has been realized by using a chrome surface on the reticle as a reflector for the detection optics arranged under the reticle. This construction permits TTL on axis alignment to be performed without movement of the detection optics and does not obstruct the exposure light. As Ar ion laser light can transmit through the multi-layer resist, the mark under the resist can be detected. Laser rocking illumination of the wafer mark and the storage type light detector (CCD) allow highly accurate detection of grainy wafers. By chromatic aberration of the reduction lens for Ar ion laser light, the image of the wafer mark is presented below the reticle after reflection. This phenomena has prevented the detection of the relative position between the wafer and reticle using single detection optics. However this problem has been eliminated by using a hyperbolic grating on reticle. The hyperbolic grating illuminated by the Ar ion laser beam projects a line shape image on the image plane of the wafer mark, and the position of the line represents the position of the reticle. The alignment system achieves overlay accuracy (3σ) of less than 0.2 μm for process wafers and stable offset (for five days) of less than 0.05 μm. The alignment time is about 0.3 seconds.

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Yoshitada Oshida, Masataka Shiba, and Atsuhiro Yoshizaki "Relative Alignment By Direct Wafer Detection Utilizing Rocking Illumination Of Ar Ion Laser", Proc. SPIE 0633, Optical Microlithography V, (20 August 1986); https://doi.org/10.1117/12.963704

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