10 June 2006 Energy variation of micro-cracking on single crystal silicon
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Proceedings Volume 6344, Advanced Laser Technologies 2005; 63441M (2006) https://doi.org/10.1117/12.694415
Event: Advanced Laser Technologies 2005, 2005, Tianjin, China
The results from nano indentation is employed to study the mechanical behaviour of materials at nanometric scale. Based on the extensive experiments using nano indentation, a new phenomenon is discovered in understanding micro cracking on single crystal silicon. Thus, a new method is proposed in evaluating the micro cracks occurring, i.e., an increasing rate of absorbed energy, which is significant in examining the brittle-to-ductile transition of single crystal silicon. This method provides a simple approach in understanding the micro cracks, while it is very tedious in conventional method. Experimental studies reveal that the increasing rate of absorbed energy in nano indentation presents an identical correlation to the surface cracks on single crystal silicon surfaces.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
F. Z. Fang, F. Z. Fang, Y. C. Liu, Y. C. Liu, } "Energy variation of micro-cracking on single crystal silicon", Proc. SPIE 6344, Advanced Laser Technologies 2005, 63441M (10 June 2006); doi: 10.1117/12.694415; https://doi.org/10.1117/12.694415

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