21 June 2006 Analytic and laser vibrometry study of squeeze film damping of MEMS cantilevers
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Proceedings Volume 6345, Seventh International Conference on Vibration Measurements by Laser Techniques: Advances and Applications; 63451C (2006) https://doi.org/10.1117/12.693065
Event: Seventh International Conference on Vibration Measurements by Laser Techniques: Advances and Applications, 2006, Ancona, Italy
Abstract
This study compares theoretical predictions to experimental measurements of squeeze film damping of MEMS cantilevers in a fluid environment. A series of MEMS cantilevers were fabricated on a silicon wafer. Each of the silicon beams was 2 μm thick and 18 μm wide. The lengths range from 100 to 800 μm and the air-filled gap between the cantilever and the substrate was 6 μm. An analytic model for squeeze film damping was used to predict the corresponding quality factor Qsqueeze film (the ratio of the mechanical energy stored in the oscillator to the energy dissipated per cycle) for these cantilevers. The results from the modeling are compared to experimental results obtained using a Polytec MSA-400 Micro System Analyzer.
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Joseph F. Vignola, Joseph F. Vignola, John A. Judge, John A. Judge, Eric Lawrence, Eric Lawrence, Jacek Jarzynski, Jacek Jarzynski, Brian Houston, Brian Houston, } "Analytic and laser vibrometry study of squeeze film damping of MEMS cantilevers", Proc. SPIE 6345, Seventh International Conference on Vibration Measurements by Laser Techniques: Advances and Applications, 63451C (21 June 2006); doi: 10.1117/12.693065; https://doi.org/10.1117/12.693065
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