Polymers for electrical connections in printed circuit boards

Ryszard Kisiel

doi:10.1117/12.714551

12 October 2006 Polymers for electrical connections in printed circuit boards

Ryszard Kisiel

Proceedings Volume 6347, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2006; 63471U (2006) https://doi.org/10.1117/12.714551
Event: Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2006, 2006, Wilga, Poland

Abstract

It is becoming more and more difficult for the conventional PCBs with mechanically drilled vias and plated through holes to meet the current packaging density requirements. To overcome these challenges, new manufacturing schemes for high density and high performance multilayer PCBs have been developed. The polymer materials play important role in finding the cheap solution. Polymer materials are used to make reliable vertical interconnects in substrates made by SBU (Sequential build-up) processes. The SBU technology with conductive paste filled microvias can achieve a connection density of up to 100 pads/cm² while the conventional PTHs can reach only 20 pads/cm². The polymer base materials can be used to replace solders in PCB assembly. The exploitation data obtained from own research, and connected with applying adhesives in inner connections into PCB as well as connected with component assembly on PCB were given.

Citation Download Citation

Ryszard Kisiel "Polymers for electrical connections in printed circuit boards", Proc. SPIE 6347, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2006, 63471U (12 October 2006); https://doi.org/10.1117/12.714551

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